a. Product Line

1.
FR-4, 1 Layer ~ 16 Layer  
Via hole
Blind Hole
Buried Hole
Laser Hole
Hole filled with epoxy and plating over
Normal Tg (Tg130)
High Tg (Tg150, Tg170)
Halogen free
.
.
2.
MCPCB  
Alumimum Base (1 Layers)
Alumimum Base (2 Layers type 1)
Alumimum Base (2 Layers,type 2)
Copper Base
 
3.
Rigid-Flex (2 Layers / Mutil-Layers)  
4.
Ceramic ( 2 Layers)  
5.
PTFE (2 Layers)  

   Finished Treatment

1

Hot Air Leveling (Tin lead / Lead free)
2
ENIG
3
ENEPIG
4
Immersion Tin
5
Immersion Silver
6
Gold Plating
7
No Shotting Bar Gold plating (Selective Gold Plating)
8
OSP
9
Electric Plating Tin
10
 

b. Products show

c. Production Process flow Chart

1
FR-4 (M/L)
          FR-4 Flow and Explanation
2
MCPCB (1/L)
3
MCPCB (2/L) - A type
4
MCPCB (2/L) - B type